Package: kmod-hwmon-w83793
Version: 4.14.193-1
Depends: kernel (=4.14.193-1-c211bb6c24cd6af23c1311cf2b84020b), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPL-2.0
Section: kernel
Architecture: mipsel_24kc_24kf
Installed-Size: 14724
Description:  Kernel module for the Winbond W83793G and W83793R chips.
